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DATA SHEET
PC2757TB, PC2758TB
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER FOR CELLULAR/CORDLESS TELEPHONE
BIPOLAR ANALOG INTEGRATED CIRCUITS
DESCRIPTION
The PC2757TB and PC2758TB are silicon monolithic integrated circuit designed as 1st frequency downconverter for cellular/cordless telephone receiver stage. The ICs consist of mixer and local amplifier. The
PC2757TB features low current consumption and the PC2758TB features improved intermodulation. From these
two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller package than conventional T suffix ICs contribute to reduce your system size. The PC2757TB and PC2758TB are manufactured using NEC's 20 GHz fT NESATTM||| silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* Wideband operation * High-density surface mounting * Low current consumption * Supply voltage * Minimized carrier leakage * Equable output impedance * Built-in power save function : fRFin = 0.1 to 2.0 GHz, fIFin = 20 to 300 MHz : 6-pin super minimold package : ICC = 5.6 mA TYP. @ PC2757TB ICC = 11 mA TYP. @ PC2758TB : VCC = 2.7 to 3.3 V : Due to double balanced mixer : Single-end push-pull IF amplifier
APPLICATIONS
* Cellular/cordless telephone up to 2.0 GHz MAX. (example: GSM, PDC800M, PDC1.5G and so on): PC2758TB * Cellular/cordless telephone up to 2.0 GHz MAX. (example: CT1, CT2 and so on): PC2757TB
ORDERING INFORMATION
Part Number Package 6-pin super minimold Markings C1X C1Y Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face the tape perforation side. Qty 3kpcs/reel. Product Type Low current consumption High OIP3
PC2757TB-E3 PC2758TB-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC2757TB, PC2758TB) Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P12771EJ2V0DS00 (2nd edition) Date Published June 2000 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1997, 2000
PC2757TB, PC2758TB
PIN CONNECTIONS
PC2757TB, PC2758TB in common
(Top View) 3 2 1 (Bottom View) 4 5 6 4 5 6 3 2 1
Pin No. 1 2 3 4
Pin Name RFinput GND LOinput PS VCC IFoutput
Example marking is for PC2757TB
C1X
5 6
PRODUCT LINE-UP (TA = +25C, VCC = 3.0 V, ZS = ZL = 50 )
Items Part No. No RF ICC (mA) 5.6 900 MHz 1.5 GHz 1.9 GHz 900 MHz CG SSB * NF SSB * NF SSB * NF (dB) (dB) (dB) (dB) 10 10 13 15 1.5 GHz CG (dB) 15 1.9 GHz CG (dB) 13 900 MHz IIP3 (dBm) -14 1.5 GHz IIP3 (dBm) -14 1.9 GHz IIP3 (dBm) -12
PC2757T PC2757TB PC2758T PC2758TB PC8112T PC8112TB
8.5 9 11 11 15 13 13 11 9 10 13 19 18 17
-13
-12
-11
-10
-9
-7
Items Part No.
900 MHz PO(sat) (dBm) -3
1.5 GHz PO(sat) (dBm) -
1.9 GHz PO(sat) (dBm) -8
900 MHz RFLO (dB) -
1.5 GHz RFLO (dB) -
1.9 GHz RFLO (dB) -
IF Output Configuration
Packages
PC2757T PC2757TB PC2758T PC2758TB PC8112T PC8112TB
6-pin minimold 6-pin super minimold Emitter follower
+1
-
-4
-
-
-
6-pin minimold 6-pin super minimold
-2.5
-3
-3
-80
-57
-55
6-pin minimold Open collector 6-pin super minimold
Remark
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet.
Caution The PC2757 and PC2758's IIP3 are calculated with IM3 = 3 which is the same IM3 inclination as
PC8112. On the other hand, OIP3 of Standard characteristics in page 6 is cross point IP.
2
Data Sheet P12771EJ2V0DS00
PC2757TB, PC2758TB
INTERNAL BLOCK DIAGRAM (PC2757TB, PC2758TB in common)
RF input
IF output POWER SAVE
LO input
VCC
GND
SYSTEM APPLICATION EXAMPLE
DIGITAL CELLULAR TELEPHONE
PC2758TB
Low noise Tr. RX DEMOD. I Q
VCO SW
/N
PLL PLL I
0 TX PA
90 Q
To know the associated products, please refer to each latest data sheet.
Data Sheet P12771EJ2V0DS00
3
PC2757TB, PC2758TB
PIN EXPLANATION (Both PC2757TB, 2758TB)
Pin No. 1 Pin Name RFinput Applied Voltage (V) - Pin Voltage Note (V) 1.2 Function and Application This pin is RF input for mixer designed as double balance type. This circuit contributes to suppress spurious signal with minimum LO and bias power consumption. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. Internal Equivalent Circuit
VCC To IF Amp. From LO
1
2
GND
GND
-
This pin is ground of IC. Must be connected to the system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. (Track length should be kept as short as possible.) This pin is LO input for local buffer designed as differential amplifier. Recommendable input level is -15 to 0 dBm. Also this symmetrical circuit can keep specified performance insensitive to processcondition distribution.
-
3
LOinput
-
1.3
VCC Mixer
3
4
PS
VCC or GND
-
This pin is for power-save function. This pin can control ON/OFF operation with bias as follows; Bias: V VPS 2.5 0 to 0.5 Operation ON OFF
VCC
4
Rise time/fall time using this pin are approximately 10 s. 5 VCC 2.7 to 3.3 - Supply voltage 3.0 0.3 V for operation. Must be connected bypass capacitor. (example: 1 000 pF) to minimize ground impedance. This pin is output from IF buffer amplifier designed as single-ended push-pull type. This pin is assigned for emitter follower output with lowimpedance. In the case of connecting to high-impedance stage, please attach external matching circuit. -
6
IFoutput
-
1.7
VCC
6
Note Each pin voltage is measured with VCC = 3.0 V
4
Data Sheet P12771EJ2V0DS00
PC2757TB, PC2758TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Power Dissipation of Package Allowance Symbol VCC PD TA = +25C Mounted on 50 x 50 x 1.6 mm double sided copper clad epoxy glass board at TA = +85C Conditions Ratings 5.5 200 Unit V mW
Operating Ambient Temperature Storage Temperature PS Pin Voltage
TA Tstg VPS TA = +25C
-40 to +85 -55 to +150 5.5
C C V
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Operating Ambient Temperature LO Input Level Symbol VCC TA PLOin MIN. 2.7 -40 -15 TYP. 3.0 +25 -10 MAX. 3.3 +85 0 Unit V C dBm
ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = VPS = 3.0 V, PLOin = -10 dBm, ZS = ZL = 50 )
PC2757TB
Parameter Circuit Current RF Frequency Response IF Frequency Response Conversion Gain 1 Symbol ICC fRF Conditions MIN. No input signal CG (CG1 -3 dB) fIFout = 130 MHz constant CG (CG1 -3 dB) fRFin = 0.8 GHz constant fRFin = 0.8 GHz, fIFout = 130 MHz PRFin = -40 dBm, Upper local fRFin = 2.0 GHz, fIFout = 250 MHz PRFin = -40 dBm, Lower local 3.7 0.1 TYP. 5.6 - - MAX. 7.7 2.0 MIN. 6.6 0.1 TYP. 11 - - MAX. 14.8 2.0 mA GHz
PC2758TB
Unit
fIF
20
300
20
300
MHz
CG1
12
15
18
16
19
22
dB
Conversion Gain 2
CG2
10 - -
13
16
14 - -
17
20
dB
Single Sideband Noise Figure 1 Single Sideband Noise Figure 2 Saturated Output Power 1 Saturated Output Power 2
SSB * NF1 fRFin = 0.8 GHz, fIFout = 130 MHz, SSB mode, Upper local SSB * NF2 fRFin = 2.0 GHz, fIFout = 250 MHz, SSB mode, Lower local PO(sat) 1 fRFin = 0.8 GHz, fIFout = 130 MHz PRFin = -10 dBm, Upper local fRFin = 2.0 GHz, fIFout = 250 MHz PRFin = -10 dBm, Lower local
10
13
9
12
dB
13
16 - -
13
15 - -
dB
-11
-3
-7
+1
dBm
PO(sat) 2
-11
-8
-7
-4
dBm
Data Sheet P12771EJ2V0DS00
5
PC2757TB, PC2758TB
STANDARD CHARACTERISTICS FOR REFERENCE (Unless otherwise specified: TA = +25C, VCC = VPS = 3.0 V, PLOin = -10 dBm, ZS = ZL = 50 )
Reference Value Parameter Output 3rd Intercept Point Symbol OIP3 Conditions fRFin = 0.8 to 2.0 GHz, fIFout = 0.1 GHz, Cross point IP fLOin = 0.8 to 2.0 GHz fLOin = 0.8 to 2.0 GHz VPS = 0.5 V
PC2757TB
+5
PC2758TB
+11
Unit dBm
LO Leakage at RF pin LO Leakage at IF pin Power-saving Current
LOrf LOif ICC(PS)
-35 -23 0.1
-30 -15 0.1
dBm dBm
A
6
Data Sheet P12771EJ2V0DS00
PC2757TB, PC2758TB
TEST CIRCUIT
PC2757TB, PC2758TB
Signal Generator 1 000 pF 50 3 C2 2 Signal Generator 1 000 pF 50 1 C1 RFinput IFoutput GND VCC 3 300 pF 5 3V C3 6 3 300 pF C4 50 Spectrum Analyzer LOinput PS 4 (Top View) POWER SAVE
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C3 LO input C2 PS
PS bias
GND
VCC
C4 Voltage supply
RF input
C1
C5
IF output
Component List
No. C1 to 2 C3 to 5 Value 1 000 pF 3 300 pF
Notes 1. 35 x 42 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. {: Through holes
APPLICATION
This IC is guaranteed on the test circuit constructed with 50 equipment and transmission line. This IC, however, does not have 50 input/output impedance, but electrical characteristics such as conversion gain and intermodulation distortion are described herein on these conditions without impedance matching. So, you should understand that conversion gain and intermodulation distortion at input level will vary when you improve VS of RF input with external circuit (50 termination or impedance matching.)
Data Sheet P12771EJ2V0DS00
7
PC2757TB, PC2758TB
TYPICAL CHARACTERISTICS (TA = +25C, on Measurement Circuit)
- PC2757TB -
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 9 no signals 8 VCC = VPS 7 6 5 4 3 2 1 0 0 1 2 3 4 Supply Voltage VCC (V) 5 6
Conversion Gain CG (dB) Circuit Current ICC (mA)
CONVERSION GAIN vs. RF INPUT FREQUENCY 20 18 16 14 12 10 VCC = VPS = 3.0 V PRFin = -40 dBm 8 PLOin = -10 dBm fIFout = 130 MHz 6 0 0.5 1.0 1.5 2.0 RF Input Frequency fRFin (GHz)
2.5
SSB NOISE FIGURE vs. RF INPUT FREQUENCY 15
SSB Noise Figure SSB * NF (dB)
14 13 12 11 10 9 8 7 6 1.4 VCC = VPS = 3.0 V PRFin = -40 dBm PLOin = -10 dBm fIFout = 130 MHz 1.6 1.8 2.0 2.2 2.4 RF Input Frequency fRFin (GHz) 2.6
Conversion Gain CG (dB)
CONVERSION GAIN vs. IF OUTPUT FREQUENCY 20 VCC = VPS = 3.0 V PRFin = -40 dBm 18 PLOin = -10 dBm fRFin = 800 MHz 16 14 12 10 8 6 0 100 200 300 400 500 600 IF Output Frequency fIFout (MHz) 700
CONVERSION GAIN vs. LO INPUT LEVEL 25
Conversion Gain CG (dB)
CONVERSION GAIN vs. LO INPUT LEVEL 25 20 15 10 5 0 -5 -50 VCC = VPS = 3.0 V fRFin = 2.0 GHz fLOin = 1.9 GHz PRFin = -40 dBm -40 -30 -20 -10 0 LO Input Level PLOin (dBm) 10
Conversion Gain CG (dB)
20 15 10 5 0 -5 -50 VCC = VPS = 3.0 V fRFin = 900 MHz fLOin = 800 MHz PRFin = -40 dBm -40 -30 -20 -10 0 LO Input Level PLOin (dBm) 10
8
Data Sheet P12771EJ2V0DS00
PC2757TB, PC2758TB
- PC2757TB -
IF Output Level of Each Tone PIFout (dBm) 3rd Order Intemodulation Distortion IM3 (dBm) IF Output Level of Each Tone PIFout (dBm) 3rd Order Intemodulation Distortion IM3 (dBm)
IF OUTPUT LEVEL, 3rd ORDER INTERMODULATION DISTORTION vs. RF INPUT LEVEL 20 fRFin = 800 MHz 10 fLOin = 930 MHz PLOin = -10 dBm 0 VCC = VPS = 3.0 V -10 -20 -30 -40 -50 -60 -70 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 RF Input Level PRFin (dBm) LO LEAKAGE AT RF PIN vs. LO INPUT FREQUENCY -10 PLOin = -10 dBm -15 VCC = VPS = 3.0 V -20 -25 -30 -35 -40 -45 -50 -55 -60 0 0.5 1 1.5 2 LO Input Frequency fLOin (GHz) 2.5 IM3 Pout
IF OUTPUT LEVEL, 3rd ORDER INTERMODULATION DISTORTION vs. RF INPUT LEVEL 20 fRFin = 2 GHz 10 fLOin = 1.75 GHz PLOin = -10 dBm 0 VCC = VPS = 3.0 V -10 -20 -30 -40 -50 -60 -70 -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 RF Input Level PRFin (dBm) LO LEAKAGE AT IF PIN vs. LO INPUT FREQUENCY -10 PLOin = -10 dBm -15 VCC = VPS = 3.0 V -20 -25 -30 -35 -40 -45 0 0.5 1 1.5 2 LO Input Frequency fLOin (GHz) 2.5 IM3 Pout
LO Leakage at RF Pin LOrf (dBm)
Remark The graphs indicate nominal characteristics.
LO Leakage at IF Pin LOif (dBm)
Data Sheet P12771EJ2V0DS00
9
PC2757TB, PC2758TB
S-PARAMETERS
- PC2757TB - Calibrated on pin of DUT
S11 Z REF 1.0 Units 1 200.0 mUnits/ 56.422 -275.59 hp MARKER 1 500.0 MHz
S11 Z REF 1.0 Units 1 200.0 mUnits/ 104.03 -413.42 hp MARKER 1 500.0 MHz
1
1
2 2 5 4 3 5 4 3
RF PORT VCC = VPS = 3.0V 1:500 MHz 56.422 -j275.59 2:900 MHz 38.68 -j152.71 3:1 500 MHz 31.699 -j88.102 4:1 900 MHz 29.209 -j65.926 5:2 500 MHz 29.209 -j44.758 S11 Z REF 1.0 Units 1 200.0 mUnits/ 90.969 -243.41 hp MARKER 1 500.0 MHz
START 0.050000000 GHz STOP 3.000000000 GHz
RF PORT VCC = 3.0V VPS = GND 1:500 MHz 104.03 -j413.42 2:900 MHz 74.82 -j243.06 3:1 500 MHz 59.266 -j154.98 4:1 900 MHz 51.227 -j124.55 5:2 500 MHz 43.996 -j95.117 S11 Z REF 1.0 Units 1 200.0 mUnits/ 114.16 -400.03 hp MARKER 1 500.0 MHz
START 0.050000000 GHz STOP 3.000000000 GHz
1
1
2 2 5 43 5 4 3
LO PORT VCC = VPS = 3.0V 1:500 MHz 90.969 -j243.41 2:900 MHz 67.828 -j150.32 3:1 500 MHz 51.488 -j97.273 4:1 900 MHz 44.621 -j77.352 5:2 500 MHz 39.627 -j56.738 S22 Z REF 1.0 Units 1 200.0 mUnits/ 19.146 7.2041 hp MARKER 1 130.0 MHz
1
START 0.050000000 GHz STOP 3.000000000 GHz
LO PORT VCC = 3.0V VPS = GND 1:500 MHz 114.16 -j400.03 2:900 MHz 75.133 -j242.73 3:1 500 MHz 53.516 -j154.21 4:1 900 MHz 44.789 -j124.74 5:2 500 MHz 37.004 -j93.828 S22 Z REF 1.0 Units 1 200.0 mUnits/ 066.38 -1.3174 k hp MARKER 1 130.0 MHz
START 0.050000000 GHz STOP 3.000000000 GHz
2
1
2
IF PORT VCC = VPS = 3.0V 1:130 MHz 19.146 -j7.2041 2:250 MHz 22.73 -j12.909
START 0.050000000 GHz STOP 3.000000000 GHz
IF PORT VCC = 3.0V VPS = GND 1:130 MHz 66.38 -j1.3174 k 2:250 MHz 88.281 -j725.41
START 0.050000000 GHz STOP 3.000000000 GHz
10
Data Sheet P12771EJ2V0DS00
PC2757TB, PC2758TB
TYPICAL CHARACTERISTICS (TA = +25C, on Measurement Circuit)
- PC2758TB -
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 20 no signals VCC = VPS
Conversion Gain CG (dB)
CONVERSION GAIN vs. RF INPUT FREQUENCY 24 VCC = VPS = 3.0 V PRFin = -40 dBm 22 PLOin = -10 dBm fIFout = 130 MHz 20 18 16 14 12 10 0 0.5 1.0 1.5 2.0 2.5 RF Input Frequency fRFin (GHz) 3.0
Circuit Current ICC (mA)
15
10
5
0
0
1
2 3 4 Supply Voltage VCC (V)
5
6
SSB Noise Figure SSB * NF (dB)
Conversion Gain CG (dB)
SSB NOISE FIGURE vs. RF INPUT FREQUENCY 20 VCC = VPS = 3.0 V PRFin = -40 dBm PLOin = -10 dBm fIFout = 130 MHz 15
CONVERSION GAIN vs. IF OUTPUT FREQUENCY 20 19 18 17 16 15 14 13 12 11 VCC = VPS = 3.0 V PRFin = -40 dBm PLOin = -10 dBm fRFin = 800 MHz 0 100 200 300 400 500 IF Output Frequency fIFout (MHz) 600
10
5 0.0
0.5 1.0 1.5 2.0 2.5 RF Input Frequency fRFin (GHz)
3.0
10
CONVERSION GAIN vs. LO INPUT LEVEL 25
Conversion Gain CG (dB) Conversion Gain CG (dB)
CONVERSION GAIN vs. LO INPUT LEVEL 25 20 15 10 5 0 -5 -50 VCC = VPS = 3.0 V fRFin = 2.0 GHz fLOin = 1.9 GHz PRFin = -40 dBm -40 -30 -20 -10 0 LO Input Level PLOin (dBm) 10
20 15 10 5 0 -5 -50 VCC = VPS = 3.0 V fRFin = 800 MHz fLOin = 930 MHz PRFin = -40 dBm -40 -30 -20 -10 0 LO Input Level PLOin (dBm) 10
Data Sheet P12771EJ2V0DS00
11
PC2757TB, PC2758TB
- PC2758TB -
IF Output Level of Each Tone PIFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm) IF Output Level of Each Tone PIFout (dBm) 3rd Order Intermodulation Distortion IM3 (dBm)
IF OUTPUT LEVEL, 3rd ORDER INTERMODULATION DISTORTION vs. RF INPUT LEVEL 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -50 -40 fRF1 = 800 MHz fRF2 = 805 MHz fLO = 900 MHz PLOin = -10 dBm VCC = VPS = 3.0 V -30 -20 -10 0 RF Input Level PRFin (dBm) 10
IF OUTPUT LEVEL, 3rd ORDER INTERMODULATION DISTORTION vs. RF INPUT LEVEL 20 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -50 -40 fRF1 = 2.0 GHz fRF2 = 2.005 GHz fLO = 1.9 GHz PLOin = -10 dBm VCC = VPS = 3.0 V -30 -20 -10 0 RF Input Level PRFin (dBm) 10
LO LEAKAGE AT RF PIN vs. LO INPUT FREQUENCY 0
LO Leakage at RF Pin LOrf (dBm)
LO LEAKAGE AT IF PIN vs. LO INPUT FREQUENCY 0
LO Leakage at IF Pin LOif (dBm)
-10 -20 -30 -40 -50 -60
-10 -20 -30 -40 -50 -60
PLOin = -10 dBm VCC = VPS = 3.0 V 0 0.5 1.0 1.5 2.0 2.5 LO Input Frequency fLOin (GHz) 3.0
PLOin = -10 dBm VCC = VPS = 3.0 V 0 0.5 1.0 1.5 2.0 2.5 LO Input Frequency fLOin (GHz) 3.0
Remark The graphs indicate nominal characteristics.
12
Data Sheet P12771EJ2V0DS00
PC2757TB, PC2758TB
S-PARAMETERS
- PC2758TB - Calibrated on pin of DUT
Z S11 REF 1.0 Units 1 200.0 mUnits/ 63.312 -261.34 hp MARKER 1 500.0 MHz Z S11 REF 1.0 Units 1 200.0 mUnits/ 107.13 -395.56 hp MARKER 1 500.0 MHz
1 1 2 5 2 4 3 5 4 3
RF PORT VCC = VPS = 3.0V 1:500 MHz 63.312 -j261.34 2:900 MHz 40.227 -j142.36 3:1 500 MHz 32.441 -j79.68 4:1 900 MHz 31.107 -j58.273 5:2 500 MHz 30.871 -j39.08 Z S11 REF 1.0 Units 1 200.0 mUnits/ 73.398 -188.13 hp MARKER 1 500.0 MHz
START 0.050000000 GHz STOP 3.000000000 GHz
RF PORT VCC = 3.0V VPS = GND 1:500 MHz 107.13 -j395.56 2:900 MHz 78.711 -j234.41 3:1 500 MHz 61.922 -j148.82 4:1 900 MHz 52.629 -j119.55 5:2 500 MHz 44.766 -j90.578 Z S11 REF 1.0 Units 1 200.0 mUnits/ 100.31 -374.75 hp MARKER 1 500.0 MHz
START 0.050000000 GHz STOP 3.000000000 GHz
1 1 2 43 2 5 4 3
5
LO PORT VCC = VPS = 3.0V 1:500 MHz 73.398 -j188.13 2:900 MHz 64.551 -j112.66 3:1 500 MHz 53.133 -j72.941 4:1 900 MHz 48.111 -j57.307 5:2 500 MHz 44.541 -j41.564 Z S22 REF 1.0 Units 1 200.0 mUnits/ 15.696 9.5011 hp MARKER 1 130.0 MHz
1
START 0.050000000 GHz STOP 3.000000000 GHz
LO PORT VCC = 3.0V VPS = GND 1:500 MHz 100.31 -j374.75 2:900 MHz 73.148 -j223.07 3:1 500 MHz 57.719 -j144.02 4:1 900 MHz 50.738 -j119.52 5:2 500 MHz 41.836 -j90.25 Z S22 REF 1.0 Units 1 200.0 mUnits/ 106.69 -1.3425 k hp MARKER 1 130.0 MHz
START 0.050000000 GHz STOP 3.000000000 GHz
2 1
2
IF PORT VCC = VPS = 3.0V 1:130 MHz 15.696 -j9.5811 2:250 MHz 21.4 -j16.331
START 0.050000000 GHz STOP 3.000000000 GHz
IF PORT VCC = 3.0V VPS = GND 1:130 MHz 106.69 -j1.3425 k 2:250 MHz 83.75 -j711.47
START 0.050000000 GHz STOP 3.000000000 GHz
Data Sheet P12771EJ2V0DS00
13
PC2757TB, PC2758TB
PACKAGE DIMENSIONS
6-pin super minimold (Unit: mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
14
Data Sheet P12771EJ2V0DS00
0 to 0.1
0.15+0.1 -0
0.2+0.1 -0.05
PC2757TB, PC2758TB
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). Keep the track length of the ground pins as short as possible. (3)y Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin. (4)y The DC cut capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Recommended Condition Symbol IR35-00-3
Soldering Method Infrared Reflow
Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Data Sheet P12771EJ2V0DS00
15
PC2757TB, PC2758TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
* The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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